OEM High TG PCBs for Automotive, Aerospace, and Defense - China Suppliers & Factory (TG150, TG170, TG180, TG260, TG300) Suppliers, Factory
Product Description
What Is High TG PCB?
PCB substrates with a Tg value of ≥ 150°C are defined as High Tg materials. The Tg of a conventional FR-4 is generally around 130–140°C.
Core Features
Withstands high temperatures of lead-free soldering (usually over 260°C). The board structure remains stable without delamination or deformation. High Tg PCBs can pass the 288°C tin furnace test without board explosion or copper foil peeling.
Lower coefficient of thermal expansion (CTE) than conventional boards, reducing warping caused by temperature changes and preventing copper layer cracking at through holes. Particularly crucial in multi-layer boards of 8 layers or more.
Low dielectric constant (e.g., 3.5±0.05 @1GHz) and low dielectric loss (as low as 0.002) reduce high-frequency signal attenuation and crosstalk. Strong chemical resistance — performance remains intact after wet treatment and immersion in chemical solutions.
Common Materials
High Tg PCBs use high-performance resin substrates. The Tg values vary across materials, adapting to the requirements of different application scenarios:
| Material | Tg Value |
|---|---|
| Rogers RO4350B | 280°C |
| Rogers RO4003C | 280°C |
| Alon 85N | 250°C |
| Isola FR408HR | 180°C |
| Weichuang6 | 185°C |
Key Application Scenarios
BMS systems in new energy vehicles and ECUs in engine compartments generate significant heat. High Tg PCBs operate stably in these high-temperature environments, ensuring driving safety.
5G base station antennas, optical modules, servers, and switches demand high-frequency signal integrity. Low-loss High Tg boards ensure signal quality and improve data transmission efficiency.
Satellite communication boards and radar control boards must endure extreme temperature differences from -40°C to 125°C. Substrates like TG180 enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature sterilized medical equipment rely on the stability of High Tg PCBs under high-temperature and long-term operation to avoid failures affecting diagnosis and treatment.
Key Points of Manufacturing Process
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Lamination Process Uses precise temperature-pressure curves combined with vacuum lamination technology. The board is bonded at ~180°C under specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure inter-layer bonding strength.
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Drilling & Impedance Control Laser drilling technology achieves hole diameter accuracy of ±25μm, suitable for micro-hole interconnection in multi-layer HDI boards. Impedance tolerances are strictly maintained within ±5% to ensure high-speed signal transmission.
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Surface Treatment Surface treatment methods such as tin plating and nickel-gold plating are preferred to prevent oxidation. Large solder mask windows are opened in the pad area to enhance adhesion between solder and the copper layer.
