Famous High TG PCB Suppliers and Factory in China for Automotive, Aerospace, and Defense Industries - TG150 to TG300 Companies, Company
Product Description
What Is High TG PCB?
Glass Transition Temperature (Tg) is the critical temperature point at which a resin substrate transforms from a hard "glassy state" to a soft and elastic "rubber-like state." Below this temperature, the material maintains dimensional stability and mechanical strength. Above it, the material begins to soften and its mechanical and electrical properties decline sharply.
High Tg PCB: Generally, PCB substrates with a Tg value of ≥ 150°C are defined as high Tg materials. The Tg of a conventional FR-4 is generally around 130–140°C.
Core Features
Withstands lead-free soldering temperatures (over 260°C) and passes 288°C tin furnace tests without board explosion, copper foil peeling, delamination, or deformation.
Lower CTE than conventional plates reduces warping from temperature changes and prevents copper layer cracking in through holes — critical for multi-layer boards of 8+ layers.
Low dielectric constant (3.5±0.05 @1GHz) and low dielectric loss (as low as 0.002) reduce high-frequency signal attenuation. Strong chemical resistance withstands wet treatment, chemical immersion, and humid environments.
Common Materials
The boards of high Tg PCBs are mostly high-performance resin substrates. The Tg values of different materials vary greatly, adapting to the requirements of different scenarios. The common types are as follows:
| Material | Tg Value |
|---|---|
| Rogers RO4350B | 280°C |
| Rogers RO4003C | 280°C |
| Alon 85N | 250°C |
| Isola FR408HR | 180°C |
| Weichuang6 | 185°C |
Key Application Scenarios
BMS systems in new energy vehicles, ECUs in engine compartments — high Tg PCBs operate stably in high-temperature environments, ensuring driving safety.
5G base station antennas, optical modules, servers, and switches — low loss characteristics ensure signal integrity and improve data transmission efficiency.
Satellite communication boards and polar radar control boards must withstand extreme temperature ranges (-40°C to 125°C). TG180 substrates enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature sterilized medical equipment rely on the stability of high Tg PCBs under high-temperature and long-term operation to avoid failures affecting diagnosis and treatment.
Key Points of Manufacturing Process
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1Lamination Process
Using a precise temperature-pressure curve combined with vacuum lamination technology, the board is bonded at ~180°C under specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure bonding strength between layers.
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2Drilling & Impedance Control
Laser drilling technology with hole diameter accuracy of ±25μm, suitable for micro-hole interconnection of multi-layer HDI boards. Impedance tolerances are strictly controlled within ±5% to ensure high-speed signal transmission.
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3Surface Treatment
Tin plating and nickel-gold plating are preferred to prevent oxidation. Large solder mask windows are opened in the pad area to enhance adhesion between solder and the copper layer.
