Never use ordinary FR-4. High-frequency dedicated boards with low loss and stable dielectric constant (such as Rogers RO4350B, RT/duroid series) must be selected. This is the cornerstone of performance.
Impedance and Transmission Lines: Precise 50Ω impedance control is essential. Use microstrip lines, striplines or coplanar waveguides and determine the precise line width through calculation/simulation. When laying out, minimize the paths and avoid right angles.
Provide a complete and solid ground plane to ensure a low-impedance return path.
Densely arrange grounding vias (especially on both sides of the transmission line) to suppress resonance and coupling.
Physically isolate the RF, digital, and power supply areas. When necessary, use shielding covers and via walls.
Strictly control the tolerance of line width and medium thickness to maintain signal integrity at high frequencies.
ENIG gold plating is preferred to ensure flatness and high-frequency conductivity across all RF signal paths.
The solder mask layer may affect the impedance, and "window opening" treatment is often adopted for RF traces.