OEM High TG PCB for Automotive, Aerospace & Defense - China Suppliers & Factory for TG150, TG170, TG180, TG260, TG300 Manufacturer, Factories
Product Description
What Is High TG PCB?
Glass Transition Temperature (Tg) is the critical temperature point at which a resin substrate (such as epoxy resin) transforms from a hard "glassy state" to a soft and elastic "rubber-like state". Below this temperature, the material maintains dimensional stability and mechanical strength. Above this temperature, the material begins to soften and its mechanical and electrical properties decline sharply.
High Tg PCB: Generally, PCB substrates with a Tg value of ≥ 150°C are defined as high Tg materials. The Tg of a conventional FR-4 is generally around 130–140°C.
Core Features
Withstands lead-free soldering temperatures (over 260°C). The board structure remains stable without delamination or deformation. Passes the 288°C tin furnace test without board explosion or copper foil peeling.
Lower coefficient of thermal expansion (CTE) reduces warping and prevents copper layer cracking at through holes. Especially crucial in multi-layer boards of 8 layers or more, ensuring reliability of plated through-hole connections.
Low dielectric constant (3.5±0.05 @1GHz) and low dielectric loss (as low as 0.002) reduce high-frequency signal attenuation and crosstalk. Strong chemical resistance — performance remains intact after wet treatment and chemical immersion.
Common Materials
High Tg PCBs mostly use high-performance resin substrates. The Tg values of different materials vary greatly, adapting to the requirements of different scenarios. Common types are as follows:
| Material | Tg Value |
|---|---|
| Rogers RO4350B | 280°C |
| Rogers RO4003C | 280°C |
| Alon 85N | 250°C |
| Isola FR408HR | 180°C |
| Weichuang6 | 185°C |
Key Application Scenarios
BMS systems in new energy vehicles and ECUs in engine compartments generate substantial heat. High Tg PCBs operate stably in high-temperature environments, ensuring driving safety.
5G base station antennas, optical modules, servers, and switches demand high-frequency signal transmission. Low-loss high Tg boards ensure signal integrity and improve data transmission efficiency.
Satellite communication boards and polar radar control boards must withstand extreme temperature differences from -40°C to 125°C. TG180 substrates enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature disinfected medical equipment rely on the stability of high Tg PCBs under high-temperature and long-term operation to ensure accurate diagnosis and treatment.
Key Points of Manufacturing Process
-
Lamination Process
Using a precise temperature-pressure curve combined with vacuum lamination technology, the board is bonded at approximately 180°C under specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure strong interlayer bonding.
-
Drilling & Impedance Control
Laser drilling technology is widely used with hole diameter accuracy of ±25μm, suitable for micro-hole interconnection in multi-layer HDI boards. Impedance tolerances are strictly kept within ±5% to ensure high-speed signal transmission.
-
Surface Treatment
To prevent oxidation, surface treatment methods such as tin plating and nickel-gold plating are preferred. A large solder mask window is opened in the pad area to enhance adhesion between the solder and the copper layer.
