ODM High TG PCB Suppliers and Factory in China for Automotive, Aerospace, and Defense Industries (TG150, TG170, TG180, TG260, TG300) Manufacturer, Pricelist
Product Description
What Is High TG PCB?
Glass Transition Temperature (Tg) is the critical temperature point at which a resin substrate (such as epoxy resin) transforms from a hard "glassy state" to a soft and elastic "rubber-like state." Below this temperature, the material maintains dimensional stability and mechanical strength. Above this temperature, the material begins to soften and its mechanical and electrical properties decline sharply.
High Tg PCB: Generally, PCB substrates with a Tg value of ≥ 150°C are defined as high Tg materials. The Tg of a conventional FR-4 is generally around 130–140°C.
Core Features
Can withstand the high temperature of lead-free welding (usually over 260°C). The underlayment structure remains stable in high-temperature environments without delamination or deformation. High Tg PCBs can pass the 288°C tin furnace test without board explosion or copper foil peeling.
Lower coefficient of thermal expansion (CTE) than conventional plates, reducing warping from temperature changes and preventing copper layer cracking at through holes. Particularly crucial in multi-layer boards of 8 layers or more, ensuring reliable plated through-hole connections.
Low dielectric constant (e.g., 3.5±0.05 @1GHz) and low dielectric loss (as low as 0.002) reduce high-frequency signal attenuation and crosstalk, suitable for high-speed signal transmission. Strong chemical resistance and humidity tolerance for complex working conditions.
Common Materials
The boards of high Tg PCBs are mostly high-performance resin substrates. The Tg values of different materials vary greatly, adapting to the requirements of different scenarios. The common types are as follows:
| Material | Tg Value |
|---|---|
| Rogers RO4350B | 280°C |
| Rogers RO4003C | 280°C |
| Alon 85N | 250°C |
| Isola FR408HR | 180°C |
| Weichuang6 | 185°C |
Key Application Scenarios
The BMS system of new energy vehicles and ECU in the engine compartment generate large amounts of heat during operation. High Tg PCBs operate stably in high-temperature environments, ensuring driving safety.
5G base station antennas, optical modules, servers, and switches require high-frequency signal transmission. The low loss characteristic of high Tg boards ensures signal integrity and improves data transmission efficiency.
Satellite communication boards and polar radar control boards must withstand extreme temperature differences from -40°C to 125°C. PCBs using TG180 substrates enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature disinfected medical equipment rely on the stability of high Tg PCBs under high-temperature and long-term operation to avoid the impact of equipment failure on diagnosis and treatment.
Key Points of Manufacturing Process
Using a precise temperature-pressure curve in combination with vacuum lamination technology, the board is bonded at a high temperature of around 180°C under specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure the bonding strength between layers.
Laser drilling technology is widely used, with a hole diameter accuracy of ±25μm, suitable for micro-hole interconnection of multi-layer HDI boards. Impedance must be strictly controlled, with tolerances usually kept within ±5% to ensure high-speed signal transmission.
To prevent oxidation on the surface of high Tg plates, surface treatment methods such as tin plating and nickel-gold plating are preferred. A large solder mask window should be opened in the pad area to enhance the adhesion between the solder and the copper layer.
