ODM High TG PCB for Automotive & Aerospace - China Suppliers and Factory for TG150, TG170, TG180, TG260, TG300 Manufacturer, Pricelist
Product Description
Glass transition temperature (Tg) is the abbreviation of "Glass transition Temperature." It is not the melting point of the material, but rather the critical temperature point at which a resin substrate (such as epoxy resin) transforms from a hard "glassy state" to a soft and elastic "rubber-like state."
Below this temperature, the material maintains dimensional stability and mechanical strength. Above this temperature, the material begins to soften and its mechanical and electrical properties decline sharply.
High Tg PCB: Generally, PCB substrates with a Tg value of ≥ 150°C are defined as high Tg materials. The Tg of a conventional FR-4 is generally around 130–140°C.
Withstands lead-free soldering temperatures (over 260°C). The underlayment structure remains stable without delamination or deformation. Passes the 288°C tin furnace test without board explosion or copper foil peeling.
Lower coefficient of thermal expansion (CTE) than conventional plates. Reduces warping from temperature changes and prevents copper layer cracking at through holes — critical for multi-layer boards of 8 layers or more.
Low dielectric constant (e.g., 3.5±0.05 @1GHz) and low dielectric loss (as low as 0.002). Reduces high-frequency signal attenuation and crosstalk. Strong chemical resistance — performance remains intact after wet treatment and in humid environments.
The boards of high Tg PCBs are mostly high-performance resin substrates. The Tg values of different materials vary greatly, adapting to the requirements of different scenarios. The common types are as follows:
| Material | Tg Value |
|---|---|
| Rogers RO4350B | 280°C |
| Rogers RO4003C | 280°C |
| Alon 85N | 250°C |
| Isola FR408HR | 180°C |
| Weichuang6 | 185°C |
BMS systems of new energy vehicles and ECUs in engine compartments generate significant heat. High Tg PCBs operate stably in these high-temperature environments, ensuring driving safety.
5G base station antennas, optical modules, servers, and switches demand high-frequency signal integrity. The low-loss characteristics of high Tg boards ensure reliable data transmission efficiency.
Satellite communication boards and polar radar control boards must withstand extreme temperature ranges from -40°C to 125°C. TG180 substrates enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature sterilized medical equipment rely on high Tg PCB stability under high-temperature and long-term operation to avoid failures impacting diagnosis and treatment.
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1Lamination Process
Using a precise temperature-pressure curve combined with vacuum lamination technology, the board is bonded at ~180°C under specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure bonding strength between layers.
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2Drilling & Impedance Control
Laser drilling technology is widely used with hole diameter accuracy of ±25μm, suitable for micro-hole interconnection of multi-layer HDI boards. Impedance tolerances are strictly maintained within ±5% to ensure high-speed signal transmission.
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3Surface Treatment
To prevent oxidation, surface treatment methods such as tin plating and nickel-gold plating are preferred. Large solder mask windows are opened in the pad area to enhance adhesion between solder and the copper layer.
