ODM China Aluminum PCB Factory - High Thermal Conductivity Aluminum Printed Circuit Board Suppliers Quotes, Factories
Product Description
🖧 What is Aluminum PCB?
| Structural Layer | Common Materials | Core Function |
|---|---|---|
| Circuit Layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating Layer | Thermal conductive epoxy resin/ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8-8W/m · K) |
| Metal Base Layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
🎯 Main Application Scenarios
LED Lighting
LED beads (especially high-power LEDs) generate concentrated heat. Aluminum substrates are the core substrates for street lamps, spotlights, and panel lights, keeping the temperature rise of the beads within a safe range.
Power Electronics
Power modules (MOSFETs, IGBTs) of power adapters, frequency converters, and inverters require rapid heat dissipation to prevent critical component burnout.
Automotive Electronics
Widely applied in on-board LED headlights, power controllers in the engine compartment, and motor driver boards for new energy vehicles.
Audio Equipment
Engineered for power amplifier boards and audio power modules, effectively reducing sound quality distortion caused by excess heat generation.
⭐ Core Features
The metallic thermal conductivity of aluminum plates quickly transfers heat generated by components (such as LEDs and power transistors) to external heat dissipation structures, significantly reducing component temperature rise and extending operational life.
The density of aluminum alloy is substantially lower than that of copper and steel, while its bending and impact resistance outperform conventional PCBs, making it ideal for portable and vehicle-mounted devices.
The coefficient of thermal expansion (CTE) of aluminum alloy is balanced with electronic components, actively minimizing warping and solder joint cracking caused by dramatic temperature fluctuations.
The specialized dielectric insulation layer withstands high operating voltages (common breakdown voltage ≥3000V AC), effectively preventing short circuits between conductive traces and the aluminum base plate.
⚙️ Key Design and Manufacturing Points
Design Considerations
Heat dissipation pads: High-power device pads require dedicated thermal conductive pads connected to the aluminum base via metallized vias (≥0.3mm) for enhanced thermal conduction.
Line width adaptation: Designed for high-current environments. Maintain standard trace rules where 1A current corresponds to 0.3mm line width (35μm copper thickness) to avoid resistive heating.
Burr prevention: Burrs from substrate cutting can puncture insulation layers; mandatory edge chamfering (≥0.5mm) is strictly required.
Manufacturing Process
Insulation layer bonding: Processed under high-temperature and high-pressure (180℃/3MPa) lamination to guarantee a bubble-free dielectric layer with peel strength ≥1.0N/mm.
Surface treatment: Tin plating or Immersion Gold (ENIG) is strongly preferred. OSP finishes must be avoided due to lower heat endurance under rigorous thermal cycles.
Forming method: High-precision CNC milling is adopted over conventional die-cutting to ensure smooth, burr-free aluminum plate edges.
