Famous High Thermal Conductivity Aluminum PCB from China Suppliers and Factory - Ideal for Your Electronics Needs Companies, Factories
Product Description
| Structural Layer | Common Materials | Core Function |
|---|---|---|
| Circuit layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating layer | Thermal conductive epoxy resin / ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8–8W/m·K) |
| Metal base layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
💡 LED Lighting: LED beads (especially high-power LEDs) generate concentrated heat. Aluminum substrates are the core substrates for street lamps, spotlights, and panel lights, which can keep the temperature rise of the beads within a safe range.
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🌡️Ultra-High Heat Dissipation
The metallic thermal conductivity of aluminum plates can quickly transfer the heat generated by components (such as LEDs, power transistors) to the external heat dissipation structure, significantly reducing the temperature rise of the components and extending their service life.
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⚖️Lightweight + High Mechanical Strength
The density of aluminum alloy is much lower than that of copper and steel, and its bending resistance and impact resistance are superior to those of ordinary PCBs, making it suitable for portable and vehicle-mounted devices.
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📐Good Dimensional Stability
The coefficient of thermal expansion (CTE) of aluminum alloy can be matched with components, reducing warping and solder joint cracking caused by temperature changes.
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🛡️Insulation Safety
The insulation layer can withstand high voltage (common withstand voltage ≥3000V AC), preventing short circuits between the circuit and the aluminum plate.
The heat dissipation pads need to be fully in contact with the aluminum plate: under the pads of high-power devices, "heat-conducting pads" should be designed and connected to the side of the aluminum plate through metallized vias (≥0.3mm) to enhance heat dissipation.
Line width adaptation current: Aluminum substrates are mostly used in high-current scenarios. The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Avoid burrs during aluminum plate cutting: Burrs on the edges of aluminum plates can easily puncture the insulation layer, so chamfering (≥0.5mm) treatment is required.
Insulation layer bonding: High-temperature and high-pressure (180℃/3MPa) bonding is required to ensure that the insulation layer is free of bubbles and the peel strength is ≥1.0N/mm.
Surface treatment: Tin plating/nickel-gold plating is preferred, and OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of the aluminum plate edges.
