Famous High TG PCB Suppliers in China: Automotive, Aerospace & Defense Factory Solutions for TG150, TG170, TG180, TG260, TG300 Manufacturers, Quotes
Product Description
What Is High TG PCB?
Glass transition temperature: Tg is the abbreviation of "Glass transition Temperature". It is not the melting point of the material, but rather the critical temperature point at which a resin substrate (such as epoxy resin) transforms from a hard "glassy state" to a soft and elastic "rubber-like state". Below this temperature, the material maintains dimensional stability and mechanical strength. Above this temperature, the material begins to soften and its mechanical and electrical properties decline sharply.
High Tg PCB: Generally, PCB substrates with a Tg value of ≥ 150°C are defined as high Tg materials. The Tg of a conventional FR-4 is generally around 130–140℃.
Core Features
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Super Heat Resistance
It can withstand the high temperature of lead-free welding (usually over 260℃), and the underlayment structure remains stable in high-temperature environments without problems such as delamination or deformation. For instance, in the soldering process, ordinary PCBs may soften and fail due to high temperatures, while high Tg PCBs can pass the 288℃ tin furnace test without any issues such as board explosion or copper foil peeling.
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Stable Mechanical and Dimensional Properties
The coefficient of thermal expansion (CTE) is lower than that of conventional plates, which can reduce warping caused by temperature changes and prevent the copper layer at the through holes from cracking. This feature is particularly crucial in multi-layer boards of 8 layers or more, ensuring the reliability of the connection of the plated through holes.
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Outstanding Electrical and Chemical Properties
Most high Tg plates have a low dielectric constant (such as 3.5±0.05@1GHz for some high-end models) and low dielectric loss (as low as 0.002), which can reduce high-frequency signal attenuation and crosstalk, and are suitable for high-speed signal transmission. At the same time, it has strong chemical resistance — its performance remains intact even after wet treatment and immersion in chemical solutions.
Common Materials
The boards of high Tg PCBs are mostly high-performance resin substrates. The Tg values of different materials vary greatly, adapting to the requirements of different scenarios. The common types are as follows:
| Material | TG Value |
|---|---|
| Rogers RO4350B | 280℃ |
| Rogers RO4003C | 280℃ |
| Alon 85N | 250℃ |
| Isola FR408HR | 180℃ |
| Weichuang6 | 185℃ |
Key Application Scenarios
The BMS system of new energy vehicles, the ECU in the engine compartment, etc., tend to generate a large amount of heat during operation. High Tg PCBs can operate stably in this high-temperature environment, ensuring driving safety.
5G base station antennas, optical modules, as well as servers and switches have extremely high requirements for high-frequency signal transmission. The low loss characteristic of high Tg boards ensures signal integrity and improves data transmission efficiency.
Equipment such as satellite communication boards and polar environment radar control boards need to withstand extreme temperature differences ranging from -40℃ to 125℃. PCBs using substrates like TG180 can enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature disinfected medical equipment rely on the stability of high Tg PCBs under high-temperature and long-term operation to avoid the impact of equipment failure on diagnosis and treatment.
Key Points of Manufacturing Process
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Lamination Process
By using a precise temperature-pressure curve in combination with vacuum lamination technology, the board is bonded at a high temperature of around 180℃ and under a specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure the bonding strength between layers.
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Drilling and Impedance Control
Laser drilling technology is widely used, with a hole diameter accuracy of ±25μm, suitable for micro-hole interconnection of multi-layer HDI boards. At the same time, impedance must be strictly controlled, with tolerances usually kept within ±5% to ensure high-speed signal transmission.
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Surface Treatment
To prevent oxidation on the surface of high Tg plates, surface treatment methods such as tin plating and nickel-gold plating are preferred. In addition, a large solder mask window should be opened in the pad area to enhance the adhesion between the solder and the copper layer.
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Frequently Asked Questions
Standard FR-4 PCBs typically have a glass transition temperature (Tg) of around 130–140℃, while high Tg PCBs have a Tg value of ≥150℃ — with some materials reaching up to 280℃. This means high Tg PCBs offer significantly better thermal stability, lower coefficient of thermal expansion (CTE), and superior mechanical and electrical performance in demanding high-temperature environments.
Lead-free soldering typically requires temperatures above 260℃. Standard PCBs can soften, delaminate, or experience copper foil peeling at these temperatures. High Tg PCBs are specifically designed to withstand these conditions — for example, passing the 288℃ tin furnace test without board explosion or structural failure — making them essential for modern RoHS-compliant manufacturing.
Among the commonly used high Tg PCB materials, Rogers RO4350B and Rogers RO4003C both achieve a Tg value of 280℃, making them the highest-rated options. Alon 85N follows at 250℃, while Isola FR408HR and Weichuang6 offer Tg values of 180℃ and 185℃ respectively — all significantly higher than standard FR-4.
Yes. High Tg PCBs are well-suited for 5G and high-frequency applications due to their low dielectric constant (e.g., 3.5±0.05 @1GHz) and very low dielectric loss (as low as 0.002). These properties minimize high-frequency signal attenuation and crosstalk, ensuring signal integrity for 5G base station antennas, optical modules, servers, and high-speed data switches.
High Tg PCBs require specialized manufacturing processes including: vacuum lamination at approximately 180℃ with precise temperature-pressure curves to eliminate air bubbles; laser drilling with hole diameter accuracy of ±25μm for HDI multi-layer boards; strict impedance control within ±5% tolerance; and surface treatments such as tin plating or nickel-gold plating to prevent oxidation and improve solder adhesion.
Absolutely. High Tg PCBs are widely used in both medical and aerospace applications. In medical electronics, they provide reliable performance in ultrasound imaging devices and equipment that undergoes high-temperature sterilization. In aerospace and military applications, they withstand extreme temperature cycling from -40℃ to 125℃, making them suitable for satellite communication boards and radar control systems in polar environments.
