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China High Thermal Conductivity Aluminum PCB - Trusted China Suppliers and Factory for Quality Circuit Boards Manufacturers, Supplier
Product Description
What is Aluminum PCB?
| Structural Layer | Common Materials | Core Function |
|---|---|---|
| Circuit layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating layer | Thermal conductive epoxy resin / ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8–8W/m·K) |
| Metal base layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
Main Application Scenarios
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LED Lighting: LED beads (especially high-power LEDs) generate concentrated heat. Aluminum substrates are the core substrates for street lamps, spotlights, and panel lights, which can keep the temperature rise of the beads within a safe range.
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① Power Electronics: Power modules (MOSFETs, IGBTs) of power adapters, frequency converters, and inverters need to dissipate heat quickly to prevent component burnout.
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② Automotive Electronics: On-board LED headlights, power controllers in the engine compartment, motor driver boards for new energy vehicles.
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③ Audio Equipment: Power amplifier boards, audio power modules — reducing sound quality distortion caused by heat generation.
Core Features
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Ultra-High Heat Dissipation
The metallic thermal conductivity of aluminum plates can quickly transfer the heat generated by components (such as LEDs, power transistors) to the external heat dissipation structure, significantly reducing the temperature rise of the components and extending their service life. -
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Lightweight + High Mechanical Strength
The density of aluminum alloy is much lower than that of copper and steel, and its bending resistance and impact resistance are superior to those of ordinary PCBs, making it suitable for portable and vehicle-mounted devices. -
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Good Dimensional Stability
The coefficient of thermal expansion (CTE) of aluminum alloy can be matched with components, reducing warping and solder joint cracking caused by temperature changes. -
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Insulation Safety
The insulation layer can withstand high voltage (common withstand voltage ≥3000V AC), preventing short circuits between the circuit and the aluminum plate.
Key Design and Manufacturing Points
Design Considerations
The heat dissipation pads need to be fully in contact with the aluminum plate: under the pads of high-power devices, "heat-conducting pads" should be designed and connected to the side of the aluminum plate through metallized vias (≥0.3mm) to enhance heat dissipation.
Line width adaptation current: Aluminum substrates are mostly used in high-current scenarios. The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Avoid burrs during aluminum plate cutting: Burrs on the edges of aluminum plates can easily puncture the insulation layer, so chamfering (≥0.5mm) treatment is required.
Line width adaptation current: Aluminum substrates are mostly used in high-current scenarios. The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Avoid burrs during aluminum plate cutting: Burrs on the edges of aluminum plates can easily puncture the insulation layer, so chamfering (≥0.5mm) treatment is required.
Manufacturing Process
Insulation layer bonding: High-temperature and high-pressure (180℃/3MPa) bonding is required to ensure that the insulation layer is free of bubbles and the peel strength is ≥1.0N/mm.
Surface treatment: Tin plating / nickel-gold plating is preferred, and OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of the aluminum plate edges.
Surface treatment: Tin plating / nickel-gold plating is preferred, and OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of the aluminum plate edges.
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Frequently Asked Questions (FAQ)
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What is an aluminum PCB and how does it differ from a standard FR4 PCB?
An aluminum PCB (also called an aluminum substrate or metal core PCB) consists of three layers: a copper circuit layer, a thermally conductive insulating layer, and an aluminum base. Unlike standard FR4 PCBs, aluminum PCBs offer significantly superior heat dissipation, making them ideal for high-power and thermal-sensitive applications such as LED lighting and power electronics.
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What thermal conductivity levels are available for aluminum PCBs?
The insulating layer of aluminum PCBs typically provides thermal conductivity ranging from 0.8 to 8 W/m·K, depending on the material used (e.g., thermal conductive epoxy resin or ceramic-filled adhesive). Higher thermal conductivity values are selected for more demanding heat dissipation requirements.
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Which aluminum alloy grades are commonly used in aluminum PCB manufacturing?
The most commonly used aluminum alloy grades are 6061 and 5052. These alloys provide an excellent balance of thermal conductivity, mechanical strength, lightweight properties, and corrosion resistance, making them well-suited for PCB base layers in demanding environments.
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What surface finishes are recommended for aluminum PCBs?
Tin plating and nickel-gold plating (ENIG) are the preferred surface treatment options for aluminum PCBs due to their excellent heat resistance and solderability. OSP (Organic Solderability Preservative) is generally not recommended because its organic film has poor heat resistance, which can compromise performance in high-temperature applications.
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What are the key design rules to follow when designing an aluminum PCB?
Key design considerations include: designing heat-conducting pads under high-power components connected through metallized vias (≥0.3mm); sizing trace widths according to current load (1A per 0.3mm width at 35μm copper thickness); and ensuring aluminum plate edges are chamfered (≥0.5mm) to prevent insulation layer damage from burrs.
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What voltage withstand capability does the insulation layer of an aluminum PCB provide?
The insulating layer of a standard aluminum PCB can typically withstand voltages of ≥3000V AC, effectively preventing short circuits between the copper circuit layer and the aluminum base. This makes aluminum PCBs suitable for use in high-voltage power electronics and automotive applications.
