China High Thermal Conductivity Aluminum PCB from China Suppliers | Quality Manufacturing at Our Factory Suppliers, Factories
Product Description
What is Aluminum PCB?
| Structural Layer | Common Materials | Core Function |
|---|---|---|
| Circuit layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating layer | Thermal conductive epoxy resin / ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8–8W/m·K) |
| Metal base layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
Main Application Scenarios
LED beads (especially high-power LEDs) generate concentrated heat. Aluminum substrates are the core substrates for street lamps, spotlights, and panel lights, keeping the temperature rise of the beads within a safe range.
Power modules (MOSFETs, IGBTs) of power adapters, frequency converters, and inverters need to dissipate heat quickly to prevent component burnout.
On-board LED headlights, power controllers in the engine compartment, and motor driver boards for new energy vehicles.
Power amplifier boards and audio power modules, reducing sound quality distortion caused by heat generation.
Core Features
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Ultra-high Heat Dissipation
The metallic thermal conductivity of aluminum plates can quickly transfer the heat generated by components (such as LEDs, power transistors) to the external heat dissipation structure, significantly reducing the temperature rise of the components and extending their service life.
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Lightweight + High Mechanical Strength
The density of aluminum alloy is much lower than that of copper and steel, and its bending resistance and impact resistance are superior to those of ordinary PCBs, making it suitable for portable and vehicle-mounted devices.
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Good Dimensional Stability
The coefficient of thermal expansion (CTE) of aluminum alloy can be matched with components, reducing warping and solder joint cracking caused by temperature changes.
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Insulation Safety
The insulation layer can withstand high voltage (common withstand voltage ≥3000V AC), preventing short circuits between the circuit and the aluminum plate.
Key Design and Manufacturing Points
Design Considerations
The heat dissipation pads need to be fully in contact with the aluminum plate: under the pads of high-power devices, "heat-conducting pads" should be designed and connected to the side of the aluminum plate through metallized vias (≥0.3mm) to enhance heat dissipation.
Line width adaptation current: Aluminum substrates are mostly used in high-current scenarios. The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Avoid burrs during aluminum plate cutting: Burrs on the edges of aluminum plates can easily puncture the insulation layer, so chamfering (≥0.5mm) treatment is required.
Manufacturing Process
Insulation layer bonding: High-temperature and high-pressure (180℃/3MPa) bonding is required to ensure that the insulation layer is free of bubbles and the peel strength is ≥1.0N/mm.
Surface treatment: Tin plating / nickel-gold plating is preferred, and OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of the aluminum plate edges.
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Frequently Asked Questions
The primary difference is thermal management. An aluminum PCB uses a metal base layer (aluminum alloy) combined with a thermally conductive insulating layer, allowing it to dissipate heat far more efficiently than a standard FR4 PCB. This makes aluminum PCBs ideal for high-power applications such as LED lighting and power electronics, where heat buildup can damage components.
The insulating layer of an aluminum PCB typically achieves thermal conductivity values ranging from 0.8 to 8 W/m·K, depending on the material used (thermal conductive epoxy resin or ceramic filling adhesive). Higher values indicate better heat transfer from the circuit layer to the aluminum base.
The most commonly used aluminum alloy grades for PCB manufacturing are 6061 and 5052. These grades offer an excellent balance of thermal conductivity, mechanical strength, lightweight properties, and machinability, making them well-suited for demanding electronic applications including automotive and LED lighting products.
Tin plating and nickel-gold plating are the preferred surface treatment options for aluminum PCBs due to their superior heat resistance and solderability. OSP (Organic Solderability Preservative) is generally not recommended because its organic film has poor heat resistance, which can compromise performance in high-temperature environments.
The insulating layer of a standard aluminum PCB can typically withstand voltages of ≥3000V AC. This high dielectric strength ensures effective electrical isolation between the copper circuit layer and the aluminum base, preventing short circuits and ensuring safe operation in high-voltage power electronics applications.
CNC milling is preferred because it produces cleaner, more precise edges on the aluminum base, ensuring flatness and dimensional accuracy. Die-cutting, which is common for standard PCBs, can create burrs on aluminum edges that may puncture the insulating layer, compromising the board's electrical isolation and long-term reliability. CNC milling also allows chamfering (≥0.5mm) to eliminate sharp edges.
