High Tg PCB: PCB substrates with a Tg value of ≥ 150°C are defined as high Tg materials. The Tg of a conventional FR-4 is generally around 130–140°C.
It can withstand the high temperature of lead-free welding (usually over 260°C), and the underlayment structure remains stable in high-temperature environments without delamination or deformation. High Tg PCBs can pass the 288°C tin furnace test without board explosion or copper foil peeling.
The coefficient of thermal expansion (CTE) is lower than conventional plates, reducing warping caused by temperature changes and preventing copper layer cracking at through holes. This is especially critical in multi-layer boards of 8 layers or more, ensuring the reliability of plated through-hole connections.
Most high Tg plates feature a low dielectric constant (e.g., 3.5±0.05 @1GHz) and low dielectric loss (as low as 0.002), reducing high-frequency signal attenuation and crosstalk. They also exhibit strong chemical resistance, remaining stable after wet treatment, chemical immersion, and humid environments.
High Tg PCB boards use high-performance resin substrates. Tg values vary significantly across materials, adapting to different application requirements. Common types are listed below:
| Material | Tg Value |
|---|---|
| Rogers RO4350B | 280°C |
| Rogers RO4003C | 280°C |
| Alon 85N | 250°C |
| Isola FR408HR | 180°C |
| Weichuang6 | 185°C |
BMS systems for new energy vehicles and ECUs in engine compartments generate significant heat. High Tg PCBs operate stably in these environments, ensuring driving safety.
5G base station antennas, optical modules, servers, and switches demand high-frequency signal integrity. The low-loss characteristics of high Tg boards ensure efficient data transmission.
Satellite communication boards and polar radar control boards must withstand extreme temperature ranges from -40°C to 125°C. TG180 substrates enhance thermal cycling tolerance and reduce failure rates.
Ultrasound imaging devices and high-temperature sterilized medical equipment rely on high Tg PCB stability under sustained high temperatures to avoid equipment failure impacting diagnosis and treatment.
Using a precise temperature-pressure curve with vacuum lamination technology, boards are bonded at ~180°C under specific pressure to eliminate air bubbles, enhance Z-axis stability, and ensure inter-layer bonding strength.
Laser drilling technology achieves hole diameter accuracy of ±25μm, suitable for micro-hole interconnection in multi-layer HDI boards. Impedance tolerances are strictly maintained within ±5% to ensure high-speed signal transmission.
To prevent surface oxidation, tin plating and nickel-gold plating are preferred. Large solder mask windows are opened in pad areas to enhance adhesion between solder and the copper layer.