| Structural layer | Common materials | Core function |
|---|---|---|
| Circuit layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating layer | Thermal conductive epoxy resin/ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8-8W/m · K) |
| Metal base layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
Heat dissipation pads: Under the pads of high-power devices, "heat-conducting pads" should be designed and connected to the aluminum plate through metallized vias (≥0.3mm).
Line width & current: The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Edge treatment: Burrs on aluminum plate edges can puncture the insulation layer — chamfering (≥0.5mm) treatment is required.
Insulation layer bonding: High-temperature and high-pressure (180℃/3MPa) bonding is required to ensure the insulation layer is free of bubbles and peel strength is ≥1.0N/mm.
Surface treatment: Tin plating/nickel-gold plating is preferred; OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of aluminum plate edges.