Buy High Thermal Conductivity Aluminum PCB from China Suppliers - Reliable Factory Production Manufacturers, Factories
Product Description
◆ What is Aluminum PCB?
| Structural Layer | Common Materials | Core Function |
|---|---|---|
| Circuit layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating layer | Thermal conductive epoxy resin / ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8–8W/m·K) |
| Metal base layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
◆ Main Application Scenarios
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LED Lighting
LED beads (especially high-power LEDs) generate concentrated heat. Aluminum substrates are the core substrates for street lamps, spotlights, and panel lights, which can keep the temperature rise of the beads within a safe range.
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① Power Electronics
Power modules (MOSFETs, IGBTs) of power adapters, frequency converters, and inverters need to dissipate heat quickly to prevent component burnout.
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② Automotive Electronics
On-board LED headlights, power controllers in the engine compartment, motor driver boards for new energy vehicles.
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③ Audio Equipment
Power amplifier boards, audio power modules, reducing sound quality distortion caused by heat generation.
◆ Core Features
Ultra-High Heat Dissipation
The metallic thermal conductivity of aluminum plates can quickly transfer the heat generated by components (such as LEDs, power transistors) to the external heat dissipation structure, significantly reducing the temperature rise of the components and extending their service life.
Lightweight + High Mechanical Strength
The density of aluminum alloy is much lower than that of copper and steel, and its bending resistance and impact resistance are superior to those of ordinary PCBs, making it suitable for portable and vehicle-mounted devices.
Good Dimensional Stability
The coefficient of thermal expansion (CTE) of aluminum alloy can be matched with components, reducing warping and solder joint cracking caused by temperature changes.
Insulation Safety
The insulation layer can withstand high voltage (common withstand voltage ≥3000V AC), preventing short circuits between the circuit and the aluminum plate.
◆ Key Design and Manufacturing Points
Design Considerations
The heat dissipation pads need to be fully in contact with the aluminum plate: under the pads of high-power devices, "heat-conducting pads" should be designed and connected to the side of the aluminum plate through metallized vias (≥0.3mm) to enhance heat dissipation.
Line width adaptation current: Aluminum substrates are mostly used in high-current scenarios. The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Avoid burrs during aluminum plate cutting: Burrs on the edges of aluminum plates can easily puncture the insulation layer, so chamfering (≥0.5mm) treatment is required.
Manufacturing Process
Insulation layer bonding: High-temperature and high-pressure (180℃/3MPa) bonding is required to ensure that the insulation layer is free of bubbles and the peel strength is ≥1.0N/mm.
Surface treatment: Tin plating/nickel-gold plating is preferred, and OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of the aluminum plate edges.
◆ Send Inquiry
◆ Frequently Asked Questions
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Q What is an aluminum PCB and how does it differ from a standard FR4 PCB?An aluminum PCB (also called a metal core PCB) consists of three layers: a copper circuit layer, a thermally conductive insulating layer, and an aluminum alloy base. Unlike standard FR4 PCBs which use fiberglass as the substrate, aluminum PCBs offer significantly better heat dissipation, making them ideal for high-power and thermally demanding applications such as LED lighting and power electronics.
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Q What thermal conductivity range does the insulating layer of an aluminum PCB offer?The insulating layer — typically made from thermal conductive epoxy resin or ceramic filling adhesive — provides a thermal conductivity range of 0.8 to 8 W/m·K. Higher thermal conductivity values are used in more demanding applications where rapid heat transfer is critical.
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Q Which aluminum alloys are commonly used in aluminum PCB manufacturing?The most commonly used aluminum alloys for PCB base layers are 6061 and 5052. These alloys offer an excellent balance of thermal conductivity, mechanical strength, lightweight properties, and dimensional stability, making them well-suited for both consumer and industrial electronics.
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Q What surface treatment options are recommended for aluminum PCBs?Tin plating and nickel-gold (ENIG) plating are the preferred surface treatment options for aluminum PCBs due to their superior heat resistance and solderability. OSP (Organic Solderability Preservative) is generally not recommended for aluminum PCBs as the organic film has poor heat resistance under high-temperature conditions.
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Q How is the voltage withstand capability of an aluminum PCB insulating layer rated?The insulating layer of a standard aluminum PCB can typically withstand voltages of ≥3000V AC, providing reliable insulation isolation between the copper circuit layer and the aluminum base. This high withstand voltage rating ensures safety in high-voltage power electronics and automotive applications.
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Q Why is CNC milling preferred over die-cutting for forming aluminum PCBs?CNC milling is preferred for aluminum PCB forming because it ensures precise, clean edges with consistent flatness. Die-cutting, commonly used for standard FR4 PCBs, can produce burrs on aluminum edges that may puncture the insulating layer and cause short circuits. CNC milling also allows for chamfering (≥0.5mm) to prevent insulation damage and improve overall board quality.
