Buy High Thermal Conductivity Aluminum PCB from China Suppliers and Factory - Superior Performance and Reliability Supplier, Suppliers
Product Description
| Structural Layer | Common Materials | Core Function |
|---|---|---|
| Circuit layer | Electrolytic copper foil ranging from 18 to 140μm | Make circuits and carry the welding of components |
| Insulating layer | Thermal conductive epoxy resin / ceramic filling adhesive | Insulation isolation + heat conduction (thermal conductivity 0.8–8W/m·K) |
| Metal base layer | Aluminum alloy (mainly 6061/5052) | The heat dissipation base quickly disperses the heat conducted by the insulation layer |
-
💡LED Lighting LED beads (especially high-power LEDs) generate concentrated heat. Aluminum substrates are the core substrates for street lamps, spotlights, and panel lights, which can keep the temperature rise of the beads within a safe range.
-
⚡Power Electronics Power modules (MOSFETs, IGBTs) of power adapters, frequency converters, and inverters need to dissipate heat quickly to prevent component burnout.
-
🚗Automotive Electronics On-board LED headlights, power controllers in the engine compartment, motor driver boards for new energy vehicles.
-
🔊Audio Equipment Power amplifier boards, audio power modules — reducing sound quality distortion caused by heat generation.
The metallic thermal conductivity of aluminum plates can quickly transfer the heat generated by components (such as LEDs, power transistors) to the external heat dissipation structure, significantly reducing the temperature rise of the components and extending their service life.
The density of aluminum alloy is much lower than that of copper and steel, and its bending resistance and impact resistance are superior to those of ordinary PCBs, making it suitable for portable and vehicle-mounted devices.
The coefficient of thermal expansion (CTE) of aluminum alloy can be matched with components, reducing warping and solder joint cracking caused by temperature changes.
The insulation layer can withstand high voltage (common withstand voltage ≥3000V AC), preventing short circuits between the circuit and the aluminum plate.
The heat dissipation pads need to be fully in contact with the aluminum plate: under the pads of high-power devices, "heat-conducting pads" should be designed and connected to the side of the aluminum plate through metallized vias (≥0.3mm) to enhance heat dissipation.
Line width adaptation current: Aluminum substrates are mostly used in high-current scenarios. The line width should be designed according to "1A current corresponding to 0.3mm line width (copper thickness 35μm)" to avoid heat generation.
Avoid burrs during aluminum plate cutting: Burrs on the edges of aluminum plates can easily puncture the insulation layer, so chamfering (≥0.5mm) treatment is required.
Insulation layer bonding: High-temperature and high-pressure (180℃/3MPa) bonding is required to ensure that the insulation layer is free of bubbles and the peel strength is ≥1.0N/mm.
Surface treatment: Tin plating/nickel-gold plating is preferred, and OSP (organic film has poor heat resistance) should be avoided.
Forming method: CNC milling is adopted (instead of die-cutting for ordinary PCBs) to ensure the flatness of the aluminum plate edges.
An aluminum PCB is a metal-based circuit board that uses an aluminum alloy as its base layer instead of the traditional FR4 fiberglass substrate. Its key difference lies in its superior heat dissipation capability — the aluminum base quickly transfers heat away from components, making it ideal for high-power applications such as LED lighting and power electronics.
The insulating layer of an aluminum PCB typically provides a thermal conductivity of 0.8 to 8 W/m·K, depending on the type of thermally conductive adhesive used (such as epoxy resin or ceramic-filled compounds). Higher thermal conductivity values are suited for more demanding heat dissipation scenarios.
The most commonly used aluminum alloy grades are 6061 and 5052. These grades offer an excellent balance of thermal conductivity, mechanical strength, and machinability, making them well-suited for demanding PCB applications in automotive, LED, and industrial electronics.
Tin plating or nickel-gold (ENIG) plating are the preferred surface treatment options for aluminum PCBs due to their excellent heat resistance and solderability. OSP (Organic Solderability Preservative) is generally not recommended, as its organic film has poor heat resistance and may degrade during high-temperature assembly processes.
The insulation layer of a standard aluminum PCB can typically withstand a voltage of ≥3000V AC. This high dielectric strength ensures reliable electrical isolation between the copper circuit layer and the aluminum base, making it safe for use in high-voltage power electronics and automotive applications.
For aluminum PCBs in high-current scenarios, a general design rule is to allow 0.3mm of line width per 1A of current when using a copper thickness of 35μm. This guideline helps prevent excessive heat generation within the circuit traces and ensures long-term reliability of the board under load.
