🚀Core advantages
🛠️Typical applications
Power converters (AC-DC/DC-DC), BMS for new energy vehicles, industrial frequency converters, control boards for welding machines, etc.
1. Selection of copper foil thickness
• Common specifications: 70μm (2 oz), 105μm (3 oz), 140μm (4 oz), up to 420μm (12 oz).
• Matching: Large current (≥5A) use 2-4 oz; Ultra-power (≥20A) use 6-12 oz.
2. Trace and current-carrying capacity
• Keep traces short and wide to avoid narrow necks.
• Use parallel multi-layer copper foil to enhance capacity.
3. Via and pad design
• Vias: Increase diameter (≥0.5mm) and number (est. 1A per hole). Wall plating ≥20μm.
• Pads: Enlarge size (0.2-0.5mm larger) to prevent heat dissipation issues during welding.
4. Heat dissipation and insulation
• Heat dissipation: Design "copper sheet heat sinks" or metallized via arrays.
• Insulation: Widen wire spacing (≥0.2mm for 70μm copper) to prevent creepage.
⚙️ 1. Copper foil lamination and etching
Requires high-temp/high-pressure (180℃/4MPa) lamination. Etching is slow (~1μm/min); stepwise etching reduces side etching (≤0.05mm).
⚖️ 2. Lamination and warpage control
Use "symmetrical structure" (consistent copper thickness on upper/lower layers) and rigid support layers to prevent warping (≤0.5%).
✨ 3. Surface treatment
Prefer tin plating or nickel-gold plating to avoid OSP issues. Use "solder mask opening windows" for better bonding force.
The core of heavy copper PCBs is "high current carrying capacity + heat dissipation". Success depends on matching copper thickness to current requirements in design, while solving etching and warping challenges in manufacturing. Ideal for high-power industrial and energy scenarios.