PCB Company & Factory Serving Berlin

Standard prototype PCB fabrication lead times range from 24 to 72 hours depending on board complexity and layer count. For turnkey PCB Assembly (including SMT and through-hole soldering), trial-run prototypes typically complete within 3 to 9 working days once all BOM components are verified in IQC. We dispatch via prioritized air courier express (DHL Express, FedEx Priority, or UPS Worldwide) directly from Shenzhen to Berlin Brandenburg Airport (BER), typically clearing customs and reaching your facility within 48 to 72 hours.

Yes, 100% of our European exports are fully compliant with RoHS 3 (Directive 2015/863/EU) and REACH (EC 1907/2006) regulations. We maintain rigorous incoming material screening ensuring halogen-free options, lead-free surface finishes (such as Lead-Free HASL, ENIG, and Immersion Tin), and certified solder pastes (SAC305 alloys). Full material declaration sheets and CoC (Certificate of Conformance) documents are provided with every delivery lot.

Counterfeit mitigation is central to our supply chain protocol. We source all active components directly through factory-authorized franchised distributors or verified original component manufacturers. Our Incoming Quality Control (IQC) protocol includes microscopic visual inspection, package dimension verification, date code authenticity auditing, solderability testing, and decapsulation/X-ray analysis whenever obsolete or hard-to-find silicon must be vetted.

For bare-board PCB manufacturing, please upload RS-274X Gerber files or ODB++ databases along with an engineering fabrication drawing specifying finished copper weight, board thickness, dielectric stackup, solder mask color, and surface finish. For turnkey PCBA, kindly include a detailed Bill of Materials (BOM) in Excel format with manufacturer part numbers (MPN), approved alternate parts, reference designators, and an XY centroid (pick-and-place) file.

Yes. Our experienced procurement engineering team routinely conducts cost-down analysis on customer BOMs. We identify high-risk components with long lead times (30+ weeks) and suggest pin-to-pin, functional drop-in replacement components from vetted domestic semiconductor leaders, typically reducing overall BOM costs by 10% to 25% while securing sustainable volume delivery schedules.

Quality control is performed at every station: 3D Solder Paste Inspection (SPI) checks volume, alignment, and height before placement; high-speed automated optical inspection (AOI) catches misalignments and tombstoning pre- and post-reflow; 3D X-Ray inspection validates BGA ball collapse and void percentages under 15%; and First Article Inspection (FAI) with LCR meter verification is executed before mass-producing any batch. Functional testing (FCT) and environmental burn-in can be configured per your specification.